NOTE: We are upgrading our eBook operations; please allow up to 1-2 days for delivery of your eBook order.
»
Advanced Adhesives in Electronics
 
 

Advanced Adhesives in Electronics, 1st Edition

Materials, Properties and Applications

 
Advanced Adhesives in Electronics, 1st Edition,M O Alam,C Bailey,ISBN9781845695767
 
 
 

Alam   &   Bailey   

Woodhead Publishing

9781845695767

9780857092892

280

Print Book + eBook

USD 258.00
USD 430.00

Buy both together and save 40%

Print Book

Hardcover

In Stock

Estimated Delivery Time
USD 215.00

eBook
eBook Overview

DRM Free included formats: EPub, Mobi, PDF

USD 215.00
Add to Cart
 
 

Key Features

  • Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications
  • Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems
  • Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Description

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.

The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.

With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.

M O Alam

M. O. Alam is a Researcher in the School of Computing and Mathematical Sciences at the University of Greenwich, UK.

C Bailey

Christopher Bailey is a Professor in the School of Computing and Mathematical Sciences at the University of Greenwich, UK.

Affiliations and Expertise

University of Greenwich, UK

Advanced Adhesives in Electronics, 1st Edition

Introduction to adhesive joining technology for electronics. Part 1 Types of adhesive: Thermally conductive adhesives in electronics; Anisotropic conductive adhesives in electronics; Isotropic conductive adhesives in electronics; Underfill adhesive materials for flip chip applications. Part 2 Processing and properties: Structural integrity of metal-polymer adhesive interfaces in microelectronics; Modelling techniques used to assess conductive adhesive properties; Adhesive technology for photonics.
 
 
Discount on Science and Technology eBooks | Use code DRMFREE
NOTE: We are upgrading our eBook operations; please allow up to 1-2 days for delivery of your eBook order.