Skip to main content

Save up to 30% on Elsevier print and eBooks with free shipping. No promo code needed.

Save up to 30% on print and eBooks.

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

  • 1st Edition - May 22, 2015
  • Authors: E-H Wong, Y.-W. Mai
  • Language: English
  • Hardback ISBN:
    9 7 8 - 1 - 8 4 5 6 9 - 5 2 8 - 6
  • eBook ISBN:
    9 7 8 - 0 - 8 5 7 0 9 - 9 1 1 - 2

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electr… Read more

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Purchase options

LIMITED OFFER

Save 50% on book bundles

Immediately download your ebook while waiting for your print delivery. No promo code is needed.

Institutional subscription on ScienceDirect

Request a sales quote

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.

The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.

The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.