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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
1st Edition - May 22, 2015
Authors: E-H Wong, Y.-W. Mai
Language: English
Hardback ISBN:9781845695286
9 7 8 - 1 - 8 4 5 6 9 - 5 2 8 - 6
eBook ISBN:9780857099112
9 7 8 - 0 - 8 5 7 0 9 - 9 1 1 - 2
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electr…Read more
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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.
The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.
The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.
Discusses how the reliability of packaging components is a prime concern to electronics manufacturers
Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques
Includes program files and macros for additional study
All those involved in the design, development, production and application of electronics packaging and microelectronic assemblies, including both professionals in the electronics industry and academic researchers.
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Woodhead Publishing Series in Electronic and Optical Materials
Foreword
Preface
1. Introduction
1.1. Introduction to microelectronic packaging
1.2. Introduction to robust design
1.3. Organisation of the book
Part One. Advances in robust design against temperature-induced failures
2. Robust design of microelectronic assemblies against mismatched thermal expansion
2.1. Introduction
2.2. Fundamentals
2.3. Comprehensive analysis of a bilayer structure
2.4. Microelectronic assembly as a sandwich structure with a continuous bonding layer
2.5. PCB assembly as a sandwich structure with a layer of solder joints
3. Advances in creep-fatigue modelling of solder joints
3.1. Introduction
3.2. Life-prediction models for creep-fatigue
3.3. The unified equation
3.4. Self-validations and benchmarking
3.5. Applications
Part Two. Advances in robust design against moisture-induced failures
4. Moisture properties and their characterisations
4.1. Introduction
4.2. Thermodynamics of water
4.3. Sorption and its characterisation
4.4. Diffusivity and its characterisation
4.5. Hygroscopic swelling and its characterisation
5. Advances in diffusion and vapour pressure modelling
5.1. The discontinuity of concentration
5.2. The fractional saturation
5.3. Diffusion under time-varying temperature and pressure
5.4. Advances in vapour pressure modelling
Part Three. Robust design against drop impact
6. The physics of failure of portable electronic devices in drop impact
6.1. Product drop testing
6.2. The physics of failure
7. Subsystem testing of solder joints against drop impact
7.1. Board-level testing
7.2. Component-level testing
8. Fatigue resistance of solder joints: strain-life representation
8.1. Introduction
8.2. Design of test specimens
8.3. Fatigue resistance equations: materials
8.4. Fatigue resistance equations: frequency
8.5. Fatigue resistance equations: environment
9. Fatigue crack growth in solder joints at high strain rate
9.1. Introduction
9.2. Establishment of continuous crack growth tracking capability
9.3. Crack propagation characteristics: board-level drop shock test
9.4. Crack propagation characteristics: high-speed cyclic bending test
9.5. Three-dimensional fracture mechanics modelling of the crack front
9.6. Crack propagation in the solder joints of a mobile phone experiencing drop impact
10. Dynamic deformation of a printed circuit board in drop-shock
10.1. Introduction
10.2. Vibration of a test board in the JESD22-B111 drop-shock test
10.3. Analytical solutions for a spring-mass system subjected to half-sine shock
10.4. Analytical solutions for a beam/plate subjected to half-sine shock
10.5. Analysing the effects of imperfect half-sine acceleration shock
11. Stresses in solder joints due to the bending deformation of printed circuit boards in microelectronics assemblies
11.1. Introduction
11.2. The fundamentals
11.3. Bending of a PCB assembly that has a continuous bonding layer
11.4. Bending of a PCB assembly that has a discrete bonding layer
12. Rate-dependent stress–strain properties of solders
12.1. Introduction
12.2. An overview of the experimental techniques for high strain rate characterisation
12.3. Characterisations of solders using drop-weight test
12.4. The stress–strain characteristics of solders
12.5. The constitutive equations of solders
12.6. Constant strain rate testing
Index
No. of pages: 482
Language: English
Edition: 1
Published: May 22, 2015
Imprint: Woodhead Publishing
Hardback ISBN: 9781845695286
eBook ISBN: 9780857099112
YM
Y.-W. Mai
Dr Yiu-Wing Mai is Chair and Professor of Mechanical Engineering at the University of Sydney, Australia
Affiliations and expertise
University Chair and Professor of Mechanical Engineering at the University of Sydney, Australia
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