Physical Communication

 
 

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Editor-in-Chief::I.F. Akyildiz

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18744907

14-17

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Aims & Scope

PHYCOM: Physical Communication is an international and archival journal providing complete coverage of all topics of interest to those involved in all aspects of physical layer communications. Theoretical research contributions presenting new techniques, concepts or analyses, applied contributions reporting on experiences and experiments, and tutorials are published.

Topics of interest include but are not limited to:

Physical layer issues of Wireless Local Area Networks, WiMAX, Wireless Mesh Networks, Sensor and Ad Hoc Networks, PCS Systems; Radio access protocols and algorithms for the physical layer; Spread Spectrum Communications; Channel Modeling; Detection and Estimation; Modulation and Coding; Multiplexing and Carrier Techniques; Broadband Wireless Communications; Wireless Personal Communications; Multi-user Detection; Signal Separation and Interference rejection: Multimedia Communications over Wireless; DSP Applications to Wireless Systems; Experimental and Prototype Results; Multiple Access Techniques; Space-time Processing; Synchronization Techniques; Error Control Techniques; Cryptography; Software Radios; Tracking; Resource Allocation and Inference Management; Multi-rate and Multi-carrier Communications; Cross layer Design and Optimization; Propagation and Channel Characterization; OFDM Systems; MIMO Systems; Ultra-Wideband Communications; Cognitive Radio System Architectures; Platforms and Hardware Implementations for the Support of Cognitive, Radio Systems; Cognitive Radio Resource Management and Dynamic Spectrum Sharing.

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Audience

Managers and Operators of Networks as well as Designers, Implementors, Researchers, Regulatory Lawyers, Economists, Policy Analysts and Sociologists specializing in the area.

Abstracting and Indexing

Scopus
Editor-in-Chief: I.F. Akyildiz Georgia Institute of Technology, Atlanta, GA, USA, Editorial Board: R. Agustí-Comes Universitat Politecnica de Catalunya (UPC), Barcelona, Catalonia, Spain, H. Arslan University of South Florida, Tampa, FL, USA, J. Barros Universidade do Porto, Porto, Portugal, M. Bloch Georgia Tech Lorraine, Metz, France, K.C. Chen National Taiwan University, Taipei, Taiwan, ROC, L.M. Correia Universidade Técnica de Lisboa, São João De Deus, Lisboa, Portugal, O. Dobre Memorial University of Newfoundland, St John's, Canada, L. Doyle Trinity College, Dublin, Ireland, T. M. Duman Arizona State University, Tempe, AZ, USA, J.R. Fonollosa Universitat Politecnica de Catalunya (UPC), Barcelona, Spain, A. Garcia Armada Universidad Carlos III de Madrid, Madrid, Spain, L. Gavrilovska Ss. Cyril and Methodius University (UKIM), Skopje, Macedonia, W Gerstacker Friedrich-Alexander-Universität Erlangen-Nürnberg, Erlangen, Germany, M.C. Gursoy Syracuse University, Syracuse, NY, USA, D. Haccoun École Polytechnique de Montreal, Québec, QC, Canada, S. Hara Osaka City University, Osaka, Japan, K. Kansanen Norwegian University of Science & Technology, Trondheim, Norway, L. Lai Worcester Polytechnic Institute (WPI), Worcester, MA, USA, S. Maharaj University of Pretoria, Pretoria, South Africa, S. McLaughlin University of Edinburgh, Edinburgh, UK, S Miron Centre de Recherche en Automatique de Nancy (CRAN), Vandoeuvre, France, T. Ohtsuki Keio University, Yokohama, Japan, A.D. Panagopoulos National Technical University of Athens (NTUA), Zografou-Athens, Greece, T.Q.S. Quek Singapore University of Technology and Design, Singapore, L.K. Rasmussen KTH Royal Institute of Technology, Stockholm, Sweden, E. Serpedin Texas A&M University, TX, USA, M. Stojanovic Massachusetts Institute of Technology (MIT), Cambridge, MA, USA, H.-J. Su National Taiwan University, Taipei, Taiwan, ROC, S. Sun Institute for InfoComm Research, Singapore, Singapore, L. Vandendorpe Université Catholique de Louvain, Louvain-la-Neuve, Belgium, C.-X. Wang Heriot-Watt University, Riccarton, UK, L.-C. Wang National Chiao Tung University, Hsinchu, Taiwan, ROC, K.-K. Wong University College London (UCL), London, England, UK, K.T. Wong The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, D. Wuebben Universität Bremen, Bremen, Germany, L. Yang Colorado State University, Fort Collins, CO, USA, H. Zheng University of California at Santa Barbara, Santa Barbara CA, USA
 
 
 
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