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Materials Science and Engineering: A
 
 

Materials Science and Engineering: A

Structural Materials: Properties, Microstructure and Processing

 
 

Journal

 2.409(2013)

2.349

Editor-in-Chief:E.J. Lavernia

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09215093

619-648

30

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Aims & Scope

Please be advised that the Aims and Scope for the journal has recently been updated. The journal will no longer consider or publish papers on concrete and cement-based systems nor on polymeric and polymer-based materials.

Materials Science and Engineering A provides an international medium for the publication of theoretical and experimental studies related to the load-bearing capacity of materials as influenced by their basic properties, processing history, microstructure and operating environment. Appropriate submissions to Materials Science and Engineering A should include scientific and/or engineering factors which affect the microstructure - strength relationships of materials and report the changes to mechanical behavior. The journal does not seek or publish papers on concrete and cement-based systems nor on polymeric and polymer-based materials.

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Audience

Materials Scientists, Metallurgists, Mechanical Engineers, Ceramists

Abstracting and Indexing

American Ceramic Society, Cambridge Scientific Abstracts, Chemical Abstracts, Current Contents, Engineering Index, FIZ Karlsruhe, FLUIDEX, Fluid Abstracts, Glass Technology Abstracts, INSPEC - Physics Abstracts, Metals Abstracts, PASCAL/CNRS, Physikalische Berichte, Research Alert, Science Citation Index, Scopus
Editor-in-Chief E.J. Lavernia University of California at Davis, Davis, CA, USA, Editors N. Chawla Arizona State University, Tempe, AZ, USA, J. Shang University of Illinois at Urbana-Champaign, Urbana, IL, USA, M.J. Starink University of Southampton, Highfield, Southampton, UK, E. Werner Technische Universität München, Garching, Germany, J.D. Whittenberger Lindenhurst, IL, USA, Editorial Board R. Asthana Menomonie, WI, USA, H.K.D.H. Bhadeshia Cambridge, England, UK, H. Boehm Wien, Austria, P.R. Cetlin BELO HORIZONTE, Brazil, K.K. Chawla Birmingham, AL, USA, D.L. Chen Toronto, ON, Canada, F. Chen Wuhan, China, F. Chmelik Prague, Czech Republic, J. Driver St Etienne, France, D. Dunand Evanston, IL, USA, J. Eckert Dresden, Germany, G. Eggeler Bochum, Germany, F. Ernst Cleveland, OH, USA, G. Fan Knoxville, TN, USA, T. Furuhara Aoba, Sendai, Japan, C. Garcia de Andres Madrid, Spain, H.J. Gudladt Munich, Germany, M. Gupta Singapore, Singapore, K. Higashida Nishi-ku, Fukuoka, Japan, Z. Horita Fukuoka, Japan, Y. Ikuhara Tokyo, Japan, S.P. Joshi Singapore, Singapore, H.S. Kim Pohang, South Korea, J. Koike Sendai, Miyagi, Japan, L. Ladani Tucaloosa, AL, USA, T.G. Langdon Los Angeles, CA, USA, J. Lendvai Budapest, Hungary, C.G. Levi Santa Barbara, CA, USA, J. Llorca Madrid, Spain, Z.Y. Ma Shenyang, China, R. Mahmudi Tehran, Iran, S.N. Mathaudhu Research Triangle Park, NC, USA, M.A. Meyers La Jolla, CA, USA, R.S. Mishra Denton, TX, USA, R.D.K. Misra Lafayette, LA, USA, F. Mohamed Irvine, CA, USA, H. Mughrabi Erlangen, Germany, A.K. Mukhopadhyay Hyderabad, India, M. Nishida Fukuoka, Japan, S. Nutt Los Angeles, CA, USA, S. Onaka Yokohama, Japan, R. Pippan Leoben, Austria, P. Prangnell Manchester, England, UK, D. Raabe Düsseldorf, Germany, S.V. Raj Cleveland, OH, USA, W. Reimers Berlin, Germany, M. Rühle Stuttgart, Germany, W. Sha Belfast, UK, Y.-L. Shen Albuquerque, NM, USA, V. V. Silberschmidt Loughborough, England, UK, B. Skrotzki Berlin, Germany, T. Srivatsan Akron, OH, USA, M. Suery St Martin d'Hères, Cedex, France, C. Suryanarayana Orlando, FL, USA, S.C. Tjong Kowloon, Hong Kong, China, Z. Trojanová Praha 2, Czech Republic, P.J. Uggowitzer Zürich, Switzerland, R.Z. Valiev Ufa, Russian Federation, K.S. Vecchio La Jolla, San Diego, CA, USA, W.H. Wang Beijing, China, K. Xia Melbourne, VIC, Australia, F. Yang Lexington, KY, USA, D. Zhang Hamilton, New Zealand, Z. Zhang Shenyang, China, Y. Zhou Davis, CA, USA, Y.T. Zhu Los Alamos, NM, USA, Honorary Members H. Herman Stony Brook, NY, USA, C. Koch Raleigh, NC, USA, M. Koiwa Shiga, Japan
 
 
 
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