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Mechanical Systems and Signal Processing

Mechanical Systems and Signal Processing





Editor:S.G. Braun





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Aims & Scope

Mechanical Systems and Signal Processing (MSSP) is an interdisciplinary journal in Mechanical, Aerospace and Civil Engineering with the purpose of reporting scientific advancements of the highest quality arising from new techniques in sensing, instrumentation, signal processing, modelling and control of dynamic systems. MSSP papers are expected to make a demonstrable original contribution to engineering knowledge, which should be significant in terms of advancement over established methods. Especially sought are papers that include both theoretical and experimental aspects, or that include experimental material of high relevance to practical applications.

MSSP is a leader in its field and research areas covered include:

1. Actuation, Sensing and ControlVibration & noise controlTravelling wavesSmart–material systemsPiezoelectricsAdaptivityIntegrated systemsVehicle systems

2. Measurement & Signal ProcessingSignal and image processing for the understanding of mechanical systemsFull–field vibration/acoustic measurementsInstantaneous angular speed

3. NonlinearityNonlinear vibration problemsNonlinear normal modesEnergy harvesting

4. Rotating Machines, Machinery Diagnostics & SHMDiagnostics and prognosticsRotor dynamicsCracks in rotorsBearings and gearsMachine learning

5. Uncertainty Probabilistic, interval& fuzzy analysisReliability and robustness Bayesian methods

6. Vibrations, Modal Analysis &StructuresStructural modelling &identificationInverse problemsOperational modal analysisAmbient vibration testingCivil Engineering structuresIndustry–relevant papers showing interesting practical applications of established approaches will generally not be considered by MSSP but might be suitable for MSSP's sister journal 'Case Studies in Mechanical Systems and Signal Processing (CSMSSP)'


Abstracting and Indexing

Applied Mechanics Reviews, Computing Reviews, Current Contents/Engineering, Computing & Technology, Engineered Materials Abstracts, INSPEC, ISMEC, Mechanical Engineering Abstracts, Research Alert, Science Citation Index, Scopus, Shock and Vibration Digest, Zentralblatt MATH
Editor S.G. Braun Technion - Israel Institute of Technology, Haifa, Israel, Associate Editor J.E. Mottershead University of Liverpool, Liverpool, England, UK, Editorial Board J. Antoni INSA de Lyon, Villeurbanne, France, N. Bachschmid Politecnico di Milano, Milano, Italy, D. Bernal Northeastern University, Boston, MA, USA, M. Boltezar University of Ljubljana, Ljubljana, Slovenia, D. Cao Lancaster University, Lancaster, England, UK, A. Carcaterra Università di Roma "La Sapienza", Rome, Italy, C. Cempel Poznan University of Technology, Poznan, Poland, J. Chen Shanghai Jiao Tong University, Shanghai, China, W. Cholewa Silesian University of Technology, Gliwice, Poland, B.N. Datta Northern Illinois University, De Kalb, IL, USA, W. Desmet KU Leuven, Leuven, Belgium, D.J. Ewins Imperial College London, London, UK, S. Fassois University of Patras, Patras, Greece, M. Feldman Technion - Israel Institute of Technology, Haifa, Israel, L. Garibaldi Politecnico di Torino, Torino, Italy, L. Gaul Universität Stuttgart, Stuttgart, Germany, M. Hanss Universität Stuttgart, Stuttgart, Germany, G. Kerschen Université de Liège, Liège, Belgium, Y.H. Kim Korea Institute of Science and Technology (KIST), Yuseong-Gu, Daejeon, South Korea, P.R.G. Kurka Universidade Estadual de Campinas (UNICAMP), Sao Paulo, Brazil, M. Link Universität Kassel, Kassel, Germany, Y.Q. Ni The Hong Kong Polytechnic University, Kowloon, Hong Kong, R.B. Randall University of New South Wales, Sydney, NSW, Australia, A. Sestieri Università di Roma "La Sapienza", Roma, Italy, K. Shin Andong National University, Andong, Kyungbuk, South Korea, M. Trethewey Pennsylvania State University, University Park, PA, USA, H.S. Tzou University of Kentucky, Lexington, KY, USA, K. Worden University of Sheffield, Sheffield, UK, L-M. Zhang Nanjing University of Aeroautics and Astronautics, Nanjing, China, Guest Editor, Machine Learning J. Hensman University of Sheffield, Sheffield, UK
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