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Building and Environment
 
 

Building and Environment

The International Journal of Building Science and its Applications

 
 

Journal

 2.700(2013)

2.699

Editor-in-Chief:Qingyan Chen

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03601323

83-94

12

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Aims & Scope

Building and Environment is an international journal that publishes original research papers and review articles related to building science and human interaction with the built environment.

The Journal invites research articles conveying robust, tested knowledge on:


•technologies and integrated systems for high performance buildings and cities
•thermal, acoustic, visual, air quality building science and human impacts
•tools for the design and decision-making community, including tested computational, economic, educational and policy tools.
•solutions for mitigating environmental impacts and achieving low carbon, sustainable built environments.

The Journal is focused on new knowledge, rigorously verified with measurement and analysis, related to the environmental performance of buildings in different scales, ranging from cities, communities, buildings, to building systems and assemblies.

Audience

Civil engineers, environmentalists, planners, architects and designers.

Abstracting and Indexing

Architectural Periodicals Index, COMPENDEX, CSA Civil Engineering Abstracts, Current Contents/Engineering, Computing & Technology, Current Contents/SciSearch Database, Current Technology Index, Engineering Index, FLUIDEX, Fluid Abstracts: Civil Engineering Fluidex (online), GEOBASE, Health and Safety Science Abstracts, IBSEDEX Data, International Building Services Abstracts, Research Alert, SSSA/CISA/ECA/ISMEC, Science Citation Index, Scopus
Editor-in-Chief Qingyan Chen Purdue University, West Lafayette, IN, USA, Associate Editors Joseph Clarke University of Strathclyde, Glasgow, UK, Fariborz Haghighat Concordia University, Montréal, Canada, Hugo Hens KU Leuven, Leuven, Belgium, Vivian Loftness Carnegie Mellon University, Pittsburgh, PA, USA, Jianlei Niu The Hong Kong Polytechnic University, Kowloon, Hong Kong, Xudong Yang Tsinghua University, Beijng, China, Editorial Advisory Board Members Francis Allard Université de La Rochelle, La Rochelle, France, Edward Arens University of California at Berkeley, Berkeley, CA, USA, Hazim Awbi University of Reading, Reading, UK, Bert Blocken Technische Universiteit Eindhoven, Eindhoven, Netherlands, Wan-Ki Chow Polytechnic University, Kowloon, Hong Kong, China, Richard Corsi University of Texas at Austin, Austin, TX, USA, Richard de Dear University of Sydney, Sydney, NSW, Australia, David Etheridge University of Nottingham, Nottingham, UK, Marco Filippi Politecnico di Torino, Torino, Italy, Leon Glicksman Massachusetts Institute of Technology (MIT), Cambridge, MA, USA, Jan Hensen Technische Universiteit Eindhoven, Eindhoven, Netherlands, Shinsuke Kato University of Tokyo, Tokyo, Japan, Jeong Tai Kim Kyung Hee University, Yongin, South Korea, Kwang Woo Kim Seoul National University (SNU), Seoul, South Korea, Joseph Choi Lam City University of Hong Kong, Kowloon, Hong Kong, Chao-Hsin Lin Boeing Commercial Airlines Group, Everett, WA, USA, Arsen Melikov Technical University of Denmark, Lyngby, Denmark, Dirk Muller RWTH Aachen University (RWTH), Aachen, Germany, Peter Nielsen Aalborg University, Aalborg, Denmark, Maddali Ramgopal IIT Kharagpur, Kharagpur, India, Mats Sandberg KTH Research School, Gavle, Sweden, Mattheos Santamouris University of Athens, Athens, Greece, Takao Sawachi Building Research Institute, Ibaraki, Japan, Jelena Srebric Pennsylvania State University, University Park, PA, USA, Kwok Wai Tham National University of Singapore (NUS), Singapore, Jonathan Wright Loughborough University, Leicestershire, UK, Tengfang (Tim) Xu Lawrence Berkeley National Laboratory, Berkeley, CA, USA, Hong (Henry) Xue California Polytechnic State University - San Luis Obispo, Pomona, CA, USA, Hiroshi Yoshino Tohoku University, Sendai, Japan, Guoqiang Zhang Hunan University, Hunan, China, Yingping Zhang Tsinghua University, Beijing, China, Yingxin Zhu Tsinghua University, Beijing, China
 
 
 
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