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Integration, the VLSI Journal
 
 

Integration, the VLSI Journal

 
 

Journal

 0.414(2012)

0.452

Editor-in-Chief:F.V. Fernandez

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01679260

47

4

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Aims & Scope

Integration's aim is to cover every aspect of the VLSI area, with an emphasis on cross-fertilization between various fields of science, and the design, verification, test and applications of integrated circuits and systems, as well as closely related topics in process and device technologies. Individual issues will feature peer-reviewed tutorials and articles as well as reviews of recent publications. The intended coverage of the journal can be assessed by examining the following (non-exclusive) list of topics:

Specification methods and languages; Analog/Digital Integrated Circuits and Systems; VLSI architectures; Algorithms, methods and tools for modeling, simulation, synthesis and verification of integrated circuits and systems of any complexity; Embedded systems; High-level synthesis for VLSI systems; Logic synthesis and finite automata; Testing, design-for-test and test generation algorithms; Physical design; Formal verification; Algorithms implemented in VLSI systems; Systems engineering; Heterogeneous systems.

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Audience

Researchers in (Computer-Aided) Design of VLSI, VLSI Chips, Process Technology, Electrical and Electronic Engineering.

Abstracting and Indexing

Cambridge Scientific Abstracts, CompuScience, Computer Abstracts, Current Contents/CompuMath, Current Contents/Engineering, Computing & Technology, EURASIP Newsletter, Engineering Index, INSPEC, Research Alert, SCISEARCH, Science Citation Index, Scopus, Zentralblatt MATH
Editor-in-Chief F.V. Fernandez IMSE-CNM-CSIC, University of Seville, Avda Americo Vespucio s/n, E-41092 Isla de la Cartuja, Spain, Subject Editor, Algorithms and Architecture M.A. Bayoumi Ctr. for Advanced Computer Studies, University of Louisiana, P.O. Box 44330, Lafayette, LA 70504-4330, USA, Subject Editor, High-Level Synthesis R. Camposano Synopsys Inc., 700 East Middlefield Rd, Mountain View, CA 94043-4033, USA, Subject Editor, Analog and Mixed Signal Design F.V. Fernandez IMSE-CNM-CSIC, University of Seville, Avda Americo Vespucio s/n, E-41092 Isla de la Cartuja, Spain, Subject Editor, Implementations and Layout Synthesis R.H.J.M. Otten Fac. of Electrical Engineering, Eindhoven University of Technology, Postbus 513, 5600 MB Eindhoven, Netherlands, Subject Editor, IP Integration and Reuse W. Rosenstiel Wilhelm-Schickard Inst. für Informatik, Eberhard-Karls-Universität Tübingen, Raum 119 Sand 13, 72076 Tübingen, Germany, Subject Editor, Logic and State Machine Synthesis L. Stok TJ Watson Research Center, Alta Vista Company, PO Box 218, Yorktown Heights, NY 10598, USA, Associate Editors A. Acosta University of Seville, Sevilla, Spain, M. Alioto Università degli Studi di Siena, Siena, Italy, J. Anderson University of Toronto, M. Anis University of Waterloo, E. Antelo University of Santiago de Compostela, D. Atienza Alonso Universidad Complutense de Madrid, Madrid, Spain, P. Brisk University of California, Riverside, Y. Cai Tsinghua University, Beijing, China, C. Chen National Taiwan University, Taipei, Taiwan, J.-S. Chiang Tamkang University, Tamsui, Taipei, Taiwan, J.-W. Chong Hanyang University, Seoul, South Korea, J.M. Delosme Université d'Evry, Evry Cedex, France, A. Doboli State University of New York (SUNY) at Stony Brook, Stony Brook, NY, USA, G. Dündar Bogazici University, Bebek, Turkey, A. Gentile Università degli Studi di Palermo, Palermo, Italy, C.-K. Koh Purdue University, West Lafayette, IN, USA, O. Gustafsson Linkoping University, J.M. Lopez-Villegas University of Barcelona, Barcelona, Spain, W. Marnane University College Cork, Cork, Ireland, J.P. Marques-Silva University College Dublin, Belfied, Dublin, Ireland, N. Nedjah Universidade do Estado do Rio de Janeiro, Maracanã, Rio de Janeiro, Brazil, N. Nicolici McMaster University, Hamilton, ON, Canada, Gang Qu University of Maryland, College Park, MD, USA, S. Reda Brown University, A. Reyhani-Masoleh University of Western Ontario, London, Canada, A.G.M. Strollo University of Naples, A. Srivastava University of Maryland, College Park, USA, S.X.-D. Tan University of California at Davis, Riverside, CA, USA, L. Thiele Swiss Federal Institute of Technology, Zurich, Switzerland, C.-Y. Tsui Hong Kong University of Science & Technology, Clear Water Bay, Kowloon, Hong Kong, F.Y. Young University of Hong Kong, H. Zhou Northwestern University, Evanston, IL, USA
 
 
 
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