Materials Letters

An interdisciplinary journal devoted to rapid communications on the science, applications, and processing of materials.

 
 

Journal

 2.269(2013)

2.322

Editor-in-Chief:A.R. Boccaccini

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0167577X

138-161

24

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Aims & Scope

Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials.

Contributions include, but are not limited to, a variety of topics such as:

Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors
Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart
Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction
Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots.
Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing.
Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic
Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive

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Audience

Materials scientists, metallurgists, solid state chemists and physicists

Abstracting and Indexing

Ceramic Abstracts, Chemical Abstracts, Current Contents/Engineering, Computing & Technology, Current Contents/Physics, Chemical, & Earth Sciences, El Compendex Plus, Engineering Index, FIZ Karlsruhe, INSPEC, Materials Science Citation Index, Metal Abstracts (ASM International – Materials Information, Science Citation Index, Scopus
Editor-in-Chief A.R. Boccaccini Dept. of Materials Science & Engineering, Institute for Biomaterials, Friedrich-Alexander-Universität Erlangen-Nürnberg, Cauerstr. 6, 91058 Erlangen, Germany, Editors J. Hojo Dept. of Applied Chemistry, Kyushu University, 744 Motooka, Nishi-ku, 819-0395 Fukuoka, Japan, J.C. Huang Dept. of Materials and Optoelectronic Science, National Sun Yat-Sen University, 70 Lien-Hai Rd., Kaohsiung, Taiwan, 804 ROC, E. Manias Dept. of Materials Science and Engineering, Penn State University, 325-D Steidle Building, University Park, 16802, USA, T.G. Nieh Dept. of Materials Science and Engineering, University of Tennessee, Dougherty Engineering Building, Knoxville, TN 37996-2200, USA, L.S. Shvindlerman Inst. für Metallkunde und Metallphysik, RWTH Aachen University (RWTH), Kopernikusstr. 14, D-52056 Aachen, Germany, M. Wang Dept. of Mechanical Engineering, The University of Hong Kong, 7/F Haking Wong Building, Pokfulam Road, Hong Kong, China, A.F.W. Willoughby Engineering Materials, University of Southampton, University Road, Highfield, Southampton, SO17 1BJ, UK, Associate Editorial Board M. Baxendale London, England, UK, A. Bellosi Faenza, Italy, B. Bokstein Moscow, Russian Federation, M. Cinibulk Dayton, OH, USA, P. Colombo Padova, Italy, J. Dickerson Nashville, TN, USA, W. Fahrenholtz Rolla, MO, USA, N. Gao Southampton, England, UK, H. Gleiter Karlsruhe, Germany, T. Goto Aoba, Sendai, Japan, D.C. Greenspan Gainesville, FL, USA, A. Hozumi Nagoya, Aichi, Japan, V.V. Kharton Aveiro, Portugal, J.A. Kilner London, UK, I. Kityk Czestochowa, Poland, M. Lanagan University Park, PA, USA, X.G. Li Hefei, Anhui, China, Z.G. Liu Nanjing, China, T. Lopez Mexico D.F., Mexico, Z.P. Lu Beijing, China, X.L. Ma Shenyang, China, K. Mallick Coventry, England, UK, J. F. Mano Guimarães, Portugal, V. Novikov Moscow, Russian Federation, P. Reed Highfield, Southampton, UK, Y. Sakka Ibaraki, Japan, M. Sayer Kingston, ON, Canada, J. Shen Chandler, AZ, USA, T. Siegrist Tallahassee, FL, USA, N. A. Stolwijk Münster, Germany, Y. Sugahara Tokyo, Japan, W.B. White University Park, PA, USA, J-M. Yang Los Angeles, CA, USA, Y.-F. Zheng Beijing, China, C. Zollfrank Straubing, Germany, Founding Editor: F.F.Y. Wang , Editor Emeritus: J.H. Wernick
 
 
 
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