Signal Processing

An International Journal





Editor-in-Chief:B. Ottersten





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Aims & Scope

A publication of the European Association for Signal Processing (EURASIP)

Signal Processing incorporates all aspects of the theory and practice of signal processing. It features original research work, tutorial and review articles, and accounts of practical developments. It is intended for a rapid dissemination of knowledge and experience to engineers and scientists working in the research, development or practical application of signal processing.

Subject areas covered by the journal include: Signal Theory; Stochastic Processes; Detection and Estimation; Spectral Analysis; Filtering; Signal Processing Systems; Software Developments; Image Processing; Pattern Recognition; Optical Signal Processing; Digital Signal Processing; Multi-dimensional Signal Processing; Communication Signal Processing; Biomedical Signal Processing; Geophysical and Astrophysical Signal Processing; Earth Resources Signal Processing; Acoustic and Vibration Signal Processing; Data Processing; Remote Sensing; Signal Processing Technology; Radar Signal Processing; Sonar Signal Processing; Industrial Applications; New Applications.

Type of Contributions:
The journal welcomes the following types of contributions.

Original research articles:
Research articles should not exceed 30 pages (single column, double spaced) in length and must contain novel research within the scope of the journal.

Review articles:
Review articles are typically 30-60 pages (single column, double spaced) in length, and provide a comprehensive review on a scientific topic. They may be relatively broad in scope, thereby serving a tutorial function, or be quite specialized, aimed at researchers in the chosen field.

Fast Communications:
A Fast Communication is a short, self-contained article highlighting ongoing research, or reporting interesting possibly tentative ideas, or comments on previously published research. Such articles should not exceed 10 pages (single column, double spaced) in length not including figures or tables which should accompany the submission as separate files. The objective is to provide detailed, constructive feedback on submitted papers and publish high quality papers within a very short period of time.

You may be requested by the Editor to submit a revision. Please assist us in achieving our ambitious goals for short publication times by submitting a revision at your earliest convenience. One set of page proofs in PDF format will be sent by e-mail to the corresponding author, to be checked for typesetting/editing. No changes in, or additions to, the accepted (and subsequently edited) manuscript will be allowed at this stage. Proofreading is solely your responsibility.


Researchers in Signal Processing, Acoustics, Computer Science, Automatic Control, Electrical and Electronics Engineering.

Abstracting and Indexing

Current Contents/Engineering, Computing & Technology, EBSCOhost, Ei Compendex, Emerald Computer Abstracts, Engineering Index Monthly, Gale Academic OneFile, Gale Infotrac Custom, GeoRef, INSPEC, PubMed, Science Citation Index Expanded, Scopus, Web of Science, Zentralblatt MATH
Editor-in-Chief B. Ottersten KTH Royal Institute of Technology, Stockholm, Sweden, Editorial Board M. Amin Villanova University, Villanova, PA, USA, A.K. Barros Universidade Federal do Maranhao, Sao Luis, Brazil, G. Bi Nanyang Technological University, Singapore, Singapore, H. Boche Fraunhofer Institut für Nachrichtentechnik, Berlin, Germany, T.D. Bui Concordia University, Montréal, QC, Canada, M. Cagnazzo Telecom ParisTech, Paris, France, A. Carini Università degli Studi di Urbino, Urbino, Italy, R. Chellappa University of Maryland, College Park, MD, USA, S. Chen University of Southampton, Southampton, UK, N.I. Cho Seoul National University (SNU), Seoul, South Korea, P.L. Correia Universidade Técnica de Lisboa, São João De Deus, Lisboa, Portugal, J.P. Delmas TELECOM & Management SudParis, Evry, France, I. Djurovic University of Montenegro, Podgorica, Montenegro, K. Dogancay University of South Australia, Adelaide, SA, Australia, A.B. Ertuzun Bogazici University, Bebek, Istanbul, Turkey, J.R. Fonollosa Universitat Politecnica de Catalunya (UPC), Barcelona, Spain, X. Gao Xidian University, Xi'an, China, G.B. Giannakis University of Minnesota, Minneapolis, USA, F. Gini Università di Pisa, Pisa, Italy, J.-M. Guo National Taiwan University of Science and Technology, Taipei, Taiwan, ROC, M. Haardt Technische Universität Ilmenau, Ilmenau, Germany, K.V.S. Hari Indian Institute of Science, Bangalore, India, X. He Zhejiang University, Hangzhou, China, A. Jakobsson Lund University, Lund, Sweden, M. Jansen KU Leuven, Leuven, Belgium, M. Jiang Peking University, Beijing, China, M. Kieffer SUPELEC Ecole Superieure D'Electricite - University Paris Sud, Gif-sur-Yvette Cedex, France, B. Levy University of California at Davis, Davis, CA, USA, C. Mailhes ENSEEIHT, Toulouse, France, M. Mihaylova Lancaster University, Lancaster, England, UK, A. Napolitano Università di Napoli "Parthenope", Napoli, Italy, A. Nehorai Washington University in St. Louis, St. Louis, MO, USA, M. Pesavento Technische Universität Darmstadt, Darmstadt, Germany, P.A. Regalia Catholic University of America, Washington, DC, USA, M. Renfors Tampere University of Technology, Tampere, Finland, C. Richard Universite de Nice-Sophia Antipolis, Nice Cedex 02, France, A. Rontogiannis National Observatory of Athens, Penteli, Athens, Greece, B.M. Sadler U.S. Army Research Laboratory, Adelphi, MD, USA, A.H. Sayed University of California at Los Angeles (UCLA), Los Angeles, CA, USA, E. Serpedin Texas A&M University, TX, USA, P. Shi University of Adelaide, Adelaide, SA, Australia, N. Sidiropoulos Technical University of Crete, Crete, Greece, H. C. So City University of Hong Kong, Hong Kong, China, P. Stoica Uppsala Universitet, Uppsala, Sweden, D. Tao Nanyang Technological University, Singapore, Singapore, C.-C. Tseng National Kaohsiung First University of Science and Technology, Nantz District, Kaohsiung, Taiwan, ROC, S. Werner Helsinki University of Technology (TKK), HUT, Finland, L. Wu Harbin Institute of Technology, Harbin, China, D. Xu Nanyang Technological University, Singapore, Singapore, H.Y. Yu Virginia Polytechnic Institute and State University, Blacksburg, VA, USA, Y. Zhang Villanova University, Villanova, PA, USA, A.M. Zoubir Technische Universität Darmstadt, Darmstadt, Germany
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