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Embedded Mechatronic Systems, Volume 1
Analysis of Failures, Predictive Reliability
1st Edition - July 16, 2015
Editors: Abdelkhalak El Hami, Philippe Pougnet
Language: English
Hardback ISBN:9781785480133
9 7 8 - 1 - 7 8 5 4 8 - 0 1 3 - 3
eBook ISBN:9780081004845
9 7 8 - 0 - 0 8 - 1 0 0 4 8 4 - 5
In operation, mechatronics embedded systems are stressed by loads of different causes: climate (temperature, humidity), vibration, electrical and electromagnetic. These stresses in…Read more
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In operation, mechatronics embedded systems are stressed by loads of different causes: climate (temperature, humidity), vibration, electrical and electromagnetic. These stresses in components which induce failure mechanisms should be identified and modeled for better control. AUDACE is a collaborative project of the cluster Mov'eo that address issues specific to mechatronic reliability embedded systems. AUDACE means analyzing the causes of failure of components of mechatronic systems onboard. The goal of the project is to optimize the design of mechatronic devices by reliability.
The project brings together public sector laboratories that have expertise in analysis and modeling of failure, major groups of mechatronics (Valeo and Thales) in the automotive and aerospace and small and medium enterprises that have skills in characterization and validation tests
Find and develop ways to characterize and validate the design robustness and reliability of complex mechatronic devices
Develop ways to characterize physical and chemical phenomena
Identify mechanisms of failure of components of these devices
Analyze the physical and chemical mechanisms of failure, in order of importance
Model failure mechanisms and design optimization
Academics and students (masters and doctoral students), teachers and researchers, industry Major Groups and SMEs in the automotive and aerospace sectors
Preface
1: Reliability-Based Design Optimization
Abstract
1.1 Introduction
1.2 Reliability-based design optimization
1.3 Conclusion
2: Non-Destructive Characterization by Spectroscopic Ellipsometry of Interfaces in Mechatronic Devices
Abstract
2.1 Introduction
2.2 Relationship between the ellipsometric parameters and the optical characteristics of a sample
2.3 Rotating component or phase modulator ellipsometers
2.4 Relationship between ellipsometric parameters and intensity of the detected signal
2.5 Analysis of experimental data
2.6 The stack structural model
2.7 The optical model
2.8 Application of ellipsometry technique
2.9 Conclusion
3: Method of Characterizing the Electromagnetic Environment in Hyperfrequency Circuits Encapsulated within Metallic Cavities
Abstract
3.1 Introduction
3.2 Theory of metallic cavities
3.3 Effect of metal cavities on the radiated emissions of microwave circuits
3.4 Approximation of the electromagnetic field radiated in the presence of the cavity from the electromagnetic field radiated without cavity
3.5 Conclusion
4: Metrology of Static and Dynamic Displacements and Deformations Using Full-Field Techniques
Abstract
4.1 Introduction
4.2 Speckle interferometry
4.3 Moiré projection
4.4 Structured light projection
4.5 Conclusion
5: Characterization of Switching Transistors under Electrical Overvoltage Stresses
Abstract
5.1 Introduction
5.2 Stress test over ESD/EOV electric constraints
5.3 Simulation results
5.4 Experimental setup
5.5 Conclusion
6: Reliability of Radio Frequency Power Transistors to Electromagnetic and Thermal Stress
Abstract
6.1 Introduction
6.2 The GaN technology
6.3 Radiated electromagnetic stress
6.4 RF CW continuous stress
6.5 Thermal exposure
6.6 Combined stresses: RF CW + electromagnetic (EM) and electric + EM
6.7 Conclusion
7: Internal Temperature Measurement of Electronic Components
Abstract
7.1 Introduction
7.2 Experimental setup
7.3 Measurement results
7.4 Conclusion
8: Reliability Prediction of Embedded Electronic Systems: The FIDES Guide
Abstract
8.1 Introduction
8.2 Presentation of the FIDES guide
8.3 FIDES calculation on an automotive mechatronic system
8.4 Conclusion
9: Study of the Dynamic Contact between Deformable Solids
Abstract
9.1 Introduction
9.2 Preliminaries
9.3 Main results
9.4 Proposed numerical method
9.5 Numerical results
9.6 Conclusion
List of Authors
Index
Summary of Volume 2: Analysis of Failures, Modeling, Simulation and Optimization
No. of pages: 262
Language: English
Edition: 1
Published: July 16, 2015
Imprint: ISTE Press - Elsevier
Hardback ISBN: 9781785480133
eBook ISBN: 9780081004845
AE
Abdelkhalak El Hami
Abdelkhalak El Hami is Professeur des universités at the Institut National des Sciences Appliquées (INSA-Rouen) in France and is in charge of the Normandy Conservatoire National des Arts et Metiers (CNAM) Chair of Mechanics and Head of the department of mechanical engineering of INSA Normandy, as well as several European pedagogical projects. He is an expert in fluid–structure interaction studies, reliability and optimization.
Affiliations and expertise
Institut National des Sciences Appliquees (INSA-Rouen), France
PP
Philippe Pougnet
Affiliations and expertise
Reliability Expert, Valeo, Paris, France
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