Advances in CMP Polishing Technologies, 1st Edition

Advances in CMP Polishing Technologies, 1st Edition,Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa,ISBN9781437778595

Doi   &   Marinescu   &   Kurokawa   

William Andrew




229 X 152

In a field where commercial confidentiality has limited the spread of knowledge, this book opens up emerging technologies and new applications to a wide audience of engineers in the semiconductor industry and beyond.

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Key Features

Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering

Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments

The authors bring together the latest innovations and research from the USA and Japan


CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community.

Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience.

Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.


Mechanical and electrical engineers in the precision manufacturing and semiconductor industries; scientists and engineers working in the fields of CMP, polishing and tribology.

Toshiro Doi

Affiliations and Expertise

Professor of Manufacturing Processes, Department of Mechanical Engineering, Kyushu University, Japan

View additional works by Toshiro Doi

Ioan D. Marinescu

Affiliations and Expertise

University of Toledo, OH, USA

View additional works by Ioan D. Marinescu
Information about this author is currently not available.

Advances in CMP Polishing Technologies, 1st Edition

Chapter 1: Introduction

Chapter 2: Device fabrication with a silicon crystal substrate

Chapter 3: Ultra-precision technology - taking silicon single crystal as an example

Chapter 4: Applications of ultra-precision CMP in device processes

Chapter 5: The future of processing technology

Chapter 6: Progress of the semiconductor and silicon industries

Chapter 7: Summary

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