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An important resource for students, engineers and researchers working in the area of thin film deposition using physical vapor deposition (e.g. sputtering) for semiconductor, l… Read more
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Immediately download your ebook while waiting for your print delivery. No promo code is needed.
An important resource for students, engineers and researchers working in the area of thin film deposition using physical vapor deposition (e.g. sputtering) for semiconductor, liquid crystal displays, high density recording media and photovoltaic device (e.g. thin film solar cell) manufacturing. This book also reviews microelectronics industry topics such as history of inventions and technology trends, recent developments in sputtering technologies, manufacturing steps that require sputtering of thin films, the properties of thin films and the role of sputtering target performance on overall productivity of various processes. Two unique chapters of this book deal with productivity and troubleshooting issues.
The content of the book has been divided into two sections: (a) the first section (Chapter 1 to Chapter 3) has been prepared for the readers from a range of disciplines (e.g. electrical, chemical, chemistry, physics) trying to get an insight into use of sputtered films in various devices (e.g. semiconductor, display, photovoltaic, data storage), basic of sputtering and performance of sputtering target in relation to productivity, and (b) the second section (Chapter 4 to Chapter 8) has been prepared for readers who already have background knowledge of sputter deposition of thin films, materials science principles and interested in the details of sputtering target manufacturing methods, sputtering behavior and thin film properties specific to semiconductor, liquid crystal display, photovoltaic and magnetic data storage applications.
In Chapters 5 to 8, a general structure has been used, i.e. a description of the applications of sputtered thin films, sputtering target manufacturing methods (including flow charts), sputtering behavior of targets (e.g. current - voltage relationship, deposition rate) and thin film properties (e.g. microstructure, stresses, electrical properties, in-film particles). While discussing these topics, attempts have been made to include examples from the actual commercial processes to highlight the increased complexity of the commercial processes with the growth of advanced technologies. In addition to personnel working in industry setting, university researchers with advanced knowledge of sputtering would also find discussion of such topics (e.g. attributes of target design, chamber design, target microstructure, sputter surface characteristics, various troubleshooting issues) useful.
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Researchers, engineers, undergraduate and graduate students in the fields of semiconductors, displays, thin films (nanotechnology and MEMS) and related industries.
Preface
Chapter 1. Sputtering Targets and Sputtered Films for the Microelectronic Industry
1.1 Materials for microelectronics
1.2 Scope of sputtering in microelectronics
1.3 Sputtering materials for integrated circuits
1.4 Sputtering materials for liquid crystal displays
1.5 Sputtering materials for magnetic storage systems
1.6 Sputtering materials for optical storage media
1.7 Sputtering materials for photovoltaic devices
1.8 Sputtering target industry
References
Chapter 2. Sputtering and Thin Film Deposition
2.1 Introduction
2.2 Physical vapor deposition
2.3 Plasma and glow discharge
2.4 Sputter deposition of thin films
2.5 Thin film characteristics
References
Chapter 3. Performance of Sputtering Targets and Productivity
3.1 Introduction
3.2 Target chemistry
3.3 Target metallurgy
3.4 Ferromagnetic targets
3.5 Target cleaning and packaging
3.6 Target burn-in
3.7 Target utilization
References
Chapter 4. Sputtering Target Manufacturing
4.1 Introduction
4.2 Designing sputtering targets
4.3 Target material fabrication
4.4 Machining of target and backing plate
4.5 Bonding methods and bond evaluation
4.6 Particle trap formation
4.7 Degreasing and packaging
References
Chapter 5. Sputtering Targets and Thin Films for Integrated Circuits
5.1 Introduction
5.2 Titanium
5.3 Tungsten
5.4 Tungsten–titanium (W-Ti) alloys
5.5 Aluminum and its alloys
5.6 Tantalum
5.7 Copper and its alloys
5.8 Nickel–vanadium (Ni-V) alloys
5.9 Silicides
References
Chapter 6. Sputtering Targets and Thin Films for Flat Panel Displays and Photovoltaics
6.1 Introduction
6.2 Aluminum and its alloys
6.3 Molybdenum and its alloys
6.4 Chromium
6.5 Transparent conducting oxides (TCOs)
6.6 Absorbers for photovoltaics
References
Chapter 7. Ferromagnetic Sputtering Targets and Thin Films for Silicides and Data Storage
7.1 Introduction
7.2 Nickel and its alloys
7.3 Cobalt and its alloys
7.4 Silicide films
7.5 Media for data storage
References
Chapter 8. Troubleshooting in Sputter Deposition
8.1 Introduction
8.2 Long burn-in of sputtering target
8.3 In-film defect generation
8.4 Bonding-related problems
8.5 Long pump-down time and out-gassing
References
Index
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