»
Handbook of Silicon Based MEMS Materials and Technologies
 
 

Handbook of Silicon Based MEMS Materials and Technologies, 2nd Edition

 
Handbook of Silicon Based MEMS Materials and Technologies, 2nd Edition,Markku Tilli,Teruaki Motooka,Veli-Matti Airaksinen,Sami Franssila,Mervi Paulasto-Krockel,Veikko Lindroos,ISBN9780323299657
 
 
Up to
15%
off
 

Tilli   &   Motooka   &   Airaksinen   &   Franssila   &   Paulasto-Krockel   &   Lindroos   

William Andrew

9780323299657

9780323312233

826

276 X 216

A comprehensive, well-proven reference work on state-of-the-art MEMS materials, technologies and manufacturing, emphasizing current and future applications

Print Book + eBook

USD 330.00
USD 550.00

Buy both together and save 40%

Print Book

Hardcover

In Stock

Estimated Delivery Time
USD 233.75
USD 275.00

eBook
eBook Overview

VST (VitalSource Bookshelf) format

DRM-free included formats : EPUB, Mobi (for Kindle), PDF

USD 233.75
USD 275.00
Add to Cart
 
 

Key Features

  • Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques
  • Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs
  • Discusses properties, preparation, and growth of silicon crystals and wafers
  • Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures
  • Geared towards practical applications rather than theory

Description

The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS.

The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components.

Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.

Readership

Engineers, researchers, research labs and companies working in the fields of MEMS, precision engineering and microfabrication; Research students in the area of MEMS

Markku Tilli

Affiliations and Expertise

Director & Senior Vice President of Research at Okmetic, Finland

Teruaki Motooka

Affiliations and Expertise

Professor, Department of Materials Science and Engineering, Kyushu University, Japan

Veli-Matti Airaksinen

Affiliations and Expertise

Director, Aalto University at Micronova, Aalto Nanofabrication Centre, Finland

Sami Franssila

Affiliations and Expertise

Department of Materials Science and Engineering, School of Chemical Technology, Aalto University, Finland

Mervi Paulasto-Krockel

Affiliations and Expertise

Aalto University, School of Electrical Engineering, Finland

Veikko Lindroos

Affiliations and Expertise

Professor Emeritus, Department of Materials Science and Engineering, School of Science and Technology, Aalto University, Finland

Handbook of Silicon Based MEMS Materials and Technologies, 2nd Edition

Impact of Silicon MEMS
Section I: Silicon as MEMS Material
1. Properties of Silicon
2. Czochralski Growth of SiliconCrystals
3. Properties of Silicon Crystals
4. Silicon Wafers: Preparation and Properties
5. Epi Wafers: Preparation and Properties
6. Thin Films on Silicon
6.1 Thin films on Silicon: Silicon dioxide
6.2 Thin films on Silicon: Silicon nitride
6.3 Thin Films on Silicon: Poly-Si and SiGe
6.4 Thin films on Silicon: AlD
6.5 Thin Films on Silicon: Piezofilms
6.6 Thin Films on Silicon: Metal films
7. Thick-Film SOI Wafers: Preparation and Properties
Section II: Modeling in MEMS 
8. Multiscale Modeling Methods
9. Mechanical Properties of Silicon Microstuctures
10. Electrostatic and RF-properties of MEMS Structures
11. Optical Modeling of MEMS
12. Simulations of Etching Processes for MEMS Fabrication
13. Gas Damping in Vibrating MEMS Structures
Section III: Measuring MEMS 
14. Introduction to Measuring MEMS
15. Silicon Wafer and Thin Film Measurements
16. Optical Measurement of Static and Dynamic Displacement in MEMS
17. MEMS Residual Stress Characterization:  Methodology and Perspective
18. Strength of Bonded Interfaces
19. Oxygen and Bulk Microdefects in Silicon
 Section IV: Micromachining Technologies in MEMS
20. MEMS Lithography
21. Deep Reactive Ion Etching
22. Wet Etching of Silicon
23. Porous Silicon Based MEMS
24. Surface Micromachining
25. Vapour Phase Etch Processes for Silicon MEMS
26. 2 3-D Printing for MEMS
27. Microfluidics and Biomems in Silicon
Section V: Encapsulation of MEMS Components
28. Introduction to encapsulation of MEMS
29. Silicon Direct Bonding
30. Anodic Bonding
31. Glass Frit Bonding
32. Metallic Alloy Seal Bonding
33. Bonding of CMOS Processed Wafers
34. Wafer Bonding: Tools and Processes
35. Encapsulation by Film Deposition
36. Dicing of MEMS Devices
37. 3D Integration of MEMS
38. Via Technologies for MEMS
39. Outgassing and Gettering
40. Hermeticity Tests
41. MEMS Reliability
42. Appendix 1: Common Abbreviations and Acronyms
43. Appendix 2: Nanoindentation Characterization of Silicon and other MEMS Materials

 
 
Free Shipping
Shop with Confidence

Free Shipping around the world
▪ Broad range of products
▪ 30 days return policy
FAQ

Contact Us