Understanding Fabless IC Technology, 1st Edition

 
Understanding Fabless IC Technology, 1st Edition,Jeorge Hurtarte,Evert Wolsheimer,Lisa Tafoya,ISBN9780750679442
 
 
 

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9780750679442

9780080551197

296

235 X 191

Covering Fabless IC Design from application techniques to business management skills; this book has it all!

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Key Features

*Written by board members of the Fabless Semiconductor Association, an industry consortium that include Xilinx, Intersil, Micro Linear, and many other members
*Approriate for a wide range of integrated circuit (IC) designers and users who need to understand the fabless process and its advantages/limitations
*Discusses important topics such as negotiating with outside fabrication companies, choosing the right electronic design tools, protection of intellectual property and business plans, and maintaining quality control

Description

Fabless (no fabrication) IC (integrated circuit) techniques are growing rapidly and promise to become the standard method of IC manufacturing in the near future, this book will provide readers with what will soon be required knowledge of the subject. Other books on IC fabrication deal with the strictly physical process aspects of the topic and assume all factors in IC fabrication are under the control of the IC designing company. By contrast, this title recognizing that fabless IC design is often as much about managing business relationships as it is about physical processes. “Fabless” ICs are those designed and marketed by one company but actually manufactured by another.

Readership

IC engineers, design engineers (analog and digital), engineering management.

Jeorge Hurtarte

Evert Wolsheimer

Lisa Tafoya

Affiliations and Expertise

Fabless Semiconductor Association

Understanding Fabless IC Technology, 1st Edition

PART 1 – Manufacturing Strategies: Understanding Fabless IC Technology

Chapter 1: More than a Decade of Transition in the Semiconductor Industry
1.1 FSA is Established
1.2 Early Success
1.3 Early Success Trend Continues
1.4 Semiconductor Business Models
1.5 Outsourcing Will Accelerate
1.6 IDMs are Going Fabless
1.7 A Case Study: Cypress Semiconductor
1.8 More IDMs are Outsourcing
1.9 Geographic Manufacturing Centers

Chapter 2: Fabless Semiconductor Manufacturing
2.1 Foundry Revenue Growth
2.2 Semiconductor Back-End Services
2.3 Semiconductor Equipment

Chapter 3: Qualities of Successful Fabless Companies
3.1 Defining Events for the Fabless Market
3.2 Thriving in the Fabless Model
3.3 Key Qualities for Success
3.4 The Future of Fabless

PART 2 – An In-Depth Understanding of the Fabless Semiconductor Business Model

Chapter 4: Semiconductor Manufacturing Basics
4.1 Semiconductor Processes
4.2 Semiconductor Manufacturing Steps
4.3 Wafer Size
4.4 Manufacturing Costs
4.5 Conclusion

Chapter 5: Fabless ASICs
2.1 Introduction
5.2 Origins of the ASIC Industry
5.3 Emergence of the Fabless ASIC Business Model
5.4 The Fabless ASIC Model: How It Works
5.5 The Services and Capabilities of a Fabless ASIC Supplier
5.6 Conclusion

Chapter 6: Electronic Design Automation
6.1 Fabless EDA Overview
6.2 Fabless EDA Selection Process
6.3 Physical Design EDA

Chapter 7: Intellectual Property
7.1 SIP Industry Overview
7.2 SIP Business Environment
7.3 Sourcing Industry Overview
7.4 Baseline Terminology
7.5 Finding SIP and Related Products
7.6 Evaluating SIP Business Models
7.7 SIP Product Enablers
7.8 Examples by SIP Product Type
7.9 Licensing SIP Products
7.10 Provider and Buyer Perspectives
7.11 The Evolution of the IP Industry
7.12 Intellectual Property Considerations
7.13 IP Outsourcing
7.14 Making IP Work in the Fabless Semiconductor Community
7.15 IP Acquisition Considerations for Fabless IC Companies

Chapter 8: e- Commerce
8.1 The Virtual Fab Challenge
8.2 Semiconductor & Fabless Manufacturing: What is Different?
8.3 “Build to Forecast” for Outsourced Manufacturing
8.4 ERP System Solutions
8.5 The Information Ecosystem: Where Communication is Key

Chapter 9: Quality and Reliability
9.1 General
9.2 Front- End
9.3 Back-End
9.4 Environment, Health and Safety

Chapter 10: Test Development
10.1 Simplifying Outsourced Test Development
10.2 Preparations
10.3 Evaluation
10.4 Conclusion

PART 3 – Becoming a Best-in-Class Fabless Company

Chapter 11: Best Practices for Fabless Companies
11.1 Achieving Best-in-Class Operations Practices
11.2 A Foundry Manager’s Role in a Fabless Company
11.3 Closing the Loop: Understanding the Manufacturing Flow
11.4 Managing a Virtual Manufacturing Chain

Chapter 12: Building the Right Partnerships
12.1 Suppliers are (Almost) Just as Important as Customers
12.2 Operations in a Fabless Start-Up
12.3 Legal Issues for Fabless Semiconductor Companies
12.4 Semiconductor Back-End Subcontracting: No Longer a Zero-Sum Game

Chapter 13: Building the Right Relationships with the board and VCs
13.1 Creating Successful Corporate Boards in Fabless Companies
13.2 Finding the Right VC

PART 4- The Fabless Business Model: A Look into the Future

Chapter 14: Perspectives in the Future of Fabless
14.1 Keeping Up with the Pace of Change in a Fabless World
14.2 Foundry Roadmaps: Partnering, Leading and Innovating
14.3 Semiconductor Manufacturing in the 21st Century
14.4 The Emerging Dominance of China in the Technology and End Markets
 
 

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