Reliability and Failure of Electronic Materials and Devices

Reliability and Failure of Electronic Materials and Devices, 2nd Edition

Reliability and Failure of Electronic Materials and Devices, 2nd Edition,Milton Ohring,Lucian Kasprzak,ISBN9780120885749


Academic Press




229 X 152

A nearly 50% revision of this classic materials reference work

Print Book + eBook

USD 155.97
USD 259.95

Buy both together and save 40%

Print Book


In Stock

Estimated Delivery Time
USD 160.00

eBook Overview

DRM-free included formats : EPUB, Mobi (for Kindle), PDF

VST (VitalSource Bookshelf) format

USD 99.95
Add to Cart

Key Features

  • Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints
  • New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections
  • New chapter on testing procedures, sample handling and sample selection, and experimental design
  • Coverage of new packaging materials, including plastics and composites


Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.


Professional Materials Engineers working with materials used in electronic devices, including silicon chips; Electronics Engineers; Electrical Engineers; Manufacturing Engineers; Chemical Engineers

Milton Ohring

Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.

Affiliations and Expertise

Stevens Institute of Technology, Hoboken, NJ (Retired)

View additional works by Milton Ohring

Lucian Kasprzak

In 1988, Dr Lucian Kasprzak became an IEEE Fellow “For contributions to very-largescale-integrated devices through the integration of reliability physics with process development.” He discovered the hot-electron effect in short channel field-effect transistors, while at IBM in 1973. From 1992 to 1996, he was Associate Professor of Physics and Engineering Science at Franciscan University. He retired from IBM in 1995 after 30 years. In 1996, he joined Sterling Diagnostic Imaging as Reliability Manager for the Direct Radiography Program. He became Director of Reliability at Direct Radiography Corp. in 1997. Early in 2001 he became an independent Reliability Consultant.

Affiliations and Expertise

Siemens Healthcare Diagnostics (Retired)

Reliability and Failure of Electronic Materials and Devices, 2nd Edition

CH 1 An Overview of Electronic Devices and Their Reliability
CH 2 Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated
CH 3 Defects, Contamination and Yield
CH 4 The Mathematics of Failure and Reliability
CH 5 Mass Transport-Induced Failure
Ch 6 Electronic Charge-Induced Damage
CH 7 Environmental Damage to Electronic Products
CH 8 Packaging Materials, Processes, and Stresses
CH 9 Degradation of Contacts and Packages
CH 10 Degradation and Failure of Electro-Optical and Magnetic Materials and Devices
CH 11 Characterization and Failure Analysis of Material, Devices and Packages
CH 12 Future Directions and Reliability Issues
Free Shipping
Shop with Confidence

Free Shipping around the world
▪ Broad range of products
▪ 30 days return policy

Contact Us