Francesca Iacopi

Francesca Iacopi

Francesca Iacopi received her MSc in Physics from Roma I University, Italy (1996), and her PhD in E.E./Materials Science from the Katholieke Universiteit Leuven, Belgium (2004), under the supervision of Prof.Karen Maex. She has over 15 years academic and industrial experience in Materials, Processes and Characterization of Semiconductor Technologies across devices, interconnects, packaging and heterogeneous integration on silicon. In 1999 she joined IMEC (Belgium), as Staff Scientist in Interconnects and Nanotechnology. Her pioneering work on porous low-dielectric-constant materials has strongly influenced the evolution of the International Roadmap for Semiconductors for Interconnects over the 1999-2009 decade. In 2009 she was appointed Guest Professor at the University of Tokyo (Japan), hosted by Prof.Kazuo Terashima, leading research on cryogenic plasmas for the treatment of semiconductor materials. Over 2010-2011, she directed the Chip-Package Interaction strategy for GLOBALFOUNDRIES (Ca, USA), establishing roadmaps and liaising across the Germany, New York and Singapore sites of the semiconductor foundry . Successively she joined Griffith University (Australia), where her research interest is silicon carbide and graphene on silicon for Electronics, Opto-electronics, Energy and Sensing technologies. She is co-author of over 100 peer-reviewed publications and 7 granted patents. She was a 2003 recipient of a Gold Graduate Student Award from the Materials Research Society, and a 2012 recipient of a Future Fellowship from the Australian Research Council. She was awarded a “Global Innovation Award” at the TechConnect Summit in Washington DC, 2014, for "Processes enabling low cost graphene/silicon carbide MEMS".

Affiliations and Expertise

Griffith University, Queensland, Australia

Book

Editors: Francesca Iacopi & John Boeckl & Chennupati Jagadish Release Date: 06 Jul 2016
Print Book:
USD 208.25
USD 245.00